20th International Conference
on Design, Test & Technology
of Integrated Systems
15 – 17 October 2025, Athens, Greece
Important Announcement
DTTIS 2025 will take place as a hybrid (both online and face-to-face) event.
Special Registration Fees apply for remote participants.
About the Conference
DTTIS 2025 conference (International Conference on Design, Test and Technology of Integrated Systems) is the result of merging two established conferences: DTIS (International Conference on Design and Technology of Integrated Systems in nanoscale era), and DTS (International Conference on Design and Test of Integrated Systems).
The aim of the 2025 Conference is to cope with the rapidly progressing technology which, today, reaches the nanometer scale. The areas of interest include the design, test and technology of electronic products, ranging from integrated circuit modules and printed circuit boards to full systems and microsystems, as well as the methodologies and tools used in the design, verification and validation of such products.
DTTIS 2025 is an opportunity for researchers to present and discuss their latest work. DTTIS 2025 is, by design, a forum for engineers, researchers, graduate students and professors, to cross the design-technology boundary by bringing design, test, technology, and process experts together. The conference is organized annually in a Mediterranean country.
Authors of accepted papers will be invited to submit an extended version of their work to a Special Issue of a selected journal.
Key Dates
Paper Submission: June 26 July 18, 2025
Notification: July 22 July 28, 2025
Camera Ready: August 6 August 30, 2025
Topics of Interest
Integrated Systems Design:
- SOC, SIP design
- Multiprocessor systems
- Embedded systems
- Wireless systems
- Network on Chip
- Analog, Mixed Signal and RF systems
- MEMS and MOEMS systems
- Low Voltage and Low Power systems
- Innovative technologies
- Synthesis (physical, logic)
- Simulation, Validation and Verification
- 3D integration
- Hardware Security
- Hardware Acceleration for Artificial Intelligence
- Hardware/Software Co-Design for AI
- Low-Power AI Circuits
- Next-Generation IC Design for AI
- AI for Electronic Design Automation(EDA)
- Security and AI in Integrated Circuits
- IC Applications in AI-Driven Systems
Integrated Systems Technology:
- Nanoelecronics
- Device Modeling
- Material Characterization
- Failure Analysis
- New Components
- Packaging
- Process Technology
- Reliability Issues
- 3D Integration
- Chiplets
- AI-Driven Process Technology Optimization
- Technology Innovations for AI Hardware
- In-Memory and Near-Memory Computing Technologies
- Design-Technology Co-Optimization (DTCO) for AI
- AI for Semiconductor Manufacturing
- Emerging Devices and Materials for Ai Acceleration
- Energy-Efficient AI Hardware Platforms
- Security-Aware Technology for AI Systems
- 3D Integration and Packaging for AI Systems
Integrated Systems Testing:
- Defect and Fault Modeling
- Analog and Mixed Signal Testing
- MEMS/MOEMS Testing
- SOC and SIP Testing
- Delay Testing
- Memory Testing
- Fault Simulation, ATPG
- DFT, BIST, BISR
- On-line Testing
- Fault Tolerant Systems
- ATE Issues
- Alternative Test Strategies
- 3D Testing
- Test and Security Issues
- AI-Driven Test Generation and Optimization
- Design-for-Testability (DfT) for AI-Heavy SoCs
- Testing of 3D ICs and Heterogenous Systems
- Test and Reliability of AI Hardware
- Post-Silicon Validation Enhanced by AI
- Automated Defect Classification and Yield Learning
- Low-Cost and At-Speed Testing Techniques
Paper Submission
Authors are invited to submit original, unpublished research work to DTTIS’25. Paper submissions should be complete manuscripts. The paper must clearly indicate the research area, main results and contributions. The manuscript should follow the instructions included in the author’s kit on the conference website. Submitted articles should be in PDF format and uploaded on the on-line submission system. Submissions will be considered as evidence that, upon acceptance, the corresponding author assumes responsibility of preparing the final version in due time and the commitment of registration and presentation of the paper at the conference.
You can submit your work for DTTIS 2025 here:
Proposals for Special Sessions
Proposals for original, high-quality Special Sessions addressing innovative research, highlighting significant topics and emerging issues, related to the conference theme, are welcome. Special session proposals should not exceed two pages, should describe the topic and intended audience, and a short bio of organizer(s). All special session proposals should be sent to the Special Session chairs.
General Chairs
Ioannis Voyiatzis, University of West Attica, Greece
Program Chair
Athanassios Milidonis UniWA, GR
Anteneh Gebregiorgis, TUDELFT, NL
Steering Committee
Said Hamdioui, TUDelft, NL
Patrick Girard, LIRMM, FR
Hassen Aziza, Polytech MT, FR
S. Abdennadher, Intel, USA
Mohamed Masmoudi, ENIS, TN
Ioannis Voyiatzis, University of West Attica, Greece
Track Chairs
Design Track
Hassene Mnif, ENET’Com, TN
Technology Track
P. Masson, UCA, FR
Test Track
Yiorgos Tsiatouhas, UOI, GR
Special Session Chair
Riccardo Cantoro, PoliTo, IT