Submission
Key Dates
Paper Submission: June 26 July 18, 2025
Notification: July 22 July 28, 2025
Camera Ready: August 6 August 30, 2025
Paper Submissions
You can submit your work for DTTIS 2025 here:
https://welcome.molesystems.com/DTTIS/2025/
Conference Topics
Integrated Systems Design
SOC, SIP design
Multiprocessor systems
Embedded systems
Wireless systems
Network on Chip
Analog, Mixed Signal and RF systems
MEMS and MOEMS systems
Low Voltage and Low Power systems
Innovative technologies
Synthesis (physical, logic), Simulation, Validation and Verification
3D integration
Hardware Security
Integrated Systems Technology
Nanoelecronics
Device Modeling
Material Characterization
Failure Analysis
New Components
Packaging
Process Technology
Reliability Issues
3D Integration
Integrated Systems Testing
Defect and Fault Modeling
Analog and Mixed Signal Testing
MEMS/MOEMS Testing
SOC and SIP Testing
Delay Testing
Memory Testing
Fault Simulation
ATPG, DFT, BIST, BISR, On-line Testing
Fault Tolerant Systems
ATE Issues
Alternative Test Strategies
3D Testing
Test and Security Issues
Paper Submission Guidelines
Authors are invited to submit original, unpublished research contributions to DTTIS’25. Regular paper submissions should be complete manuscripts (between four and six pages). Short paper submissions (formerly poster papers) are possible and must not exceed four pages.
The paper must clearly indicate the research area, main results and contributions. The manuscript must follow the instructions included in the author’s kit on the conference website.
Submitted articles should be in PDF format and uploaded on the on-line submission system. Submissions will be considered as evidence that, upon acceptance, the corresponding author assumes responsibility of preparing the final version in due time and the commitment of registration and presentation of the paper at the conference.